Resumen
The invention relates to a method for producing cathodes for light-emitting diodes, comprising a technique for designing or producing the cathode of organic light-emitting diodes, which removes unwanted areas of metal using a predetermined pattern. The metal is eliminated by establishing a physical contact between a test probe and the metal surface (mechanical ablation). Said probe is calibrated to exert a pressure on the metal, which scratches and removes the metal without affecting the anode. The probe is fitted to a head built into a computer-controlled micropositioning device (XY). The aforementioned technique solves the problem associated with current techniques (photolithography, dry etching) which require the use of acids or solvents during the process, said products seriously affecting the organic layers below the cathode. This low-cost technique is easy to implement and to scale to large surface areas.