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Atomic layer deposition equipment and method for two-dimensional film patterning manufacturingCM Patents

Índice de la ficha

Updated at
24/07/2026
Numero publicacion
CN.121992364.A
Fecha publicacion
08/05/2026
Numero solicitud
CN202610151877
Fecha presentacion
03/02/2026

En detalle

Resumen

The invention relates to the field of semiconductor micro-nano manufacturing processes, in particular to atomic layer deposition equipment and method for two-dimensional film patterning manufacturing. The core of the preparation method is that a bearing platform in a deposition cavity is replaced by a multi-station rotating disc, the disc is provided with a plurality of double-layer stations in the circumferential direction, the upper layer is used for fixing a patterned mask, and the lower layer is used for fixing a deposition substrate; and an external control system drives the disc to rotate step by step, so that the stations sequentially enter a central deposition reaction area, and flexible definition of two-dimensional material film deposition of atomic deposition on the surface of the substrate and a preset pattern is realized in cooperation with alternate pulses of a precursor source. The structure supports the design of various patterning masks and multi-substrate continuous processing, and the flexibility and the process efficiency of patterned film preparation are remarkably improved.

Etiquetas

Inventores
Liu LeiZhang HongchengChen YunfeiWang Deyi刘磊张宏程陈云飞王德义
Solicitantes
Southeast UnivUniv SoutheastCentro de Investig ¨U N Nanomateriais de Madrid东南大学西班牙马德里高等材料研究院高性能纳米材料研究中心
Clasificacion ipc
C23C 16/ 04 A IC23C 16/ 455 A IC23C 16/ 458 A IC23C 16/ 52 A IC23C 16/ 56 A I
Publicaciones
CN.121992364.A
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