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DATA PROCESSING INTERFACE DEVICECM Patents

Índice de la ficha

Updated at
24/07/2026
Numero publicacion
US.2010211336.A1
Fecha publicacion
19/08/2010
Numero solicitud
US20090388593
Fecha presentacion
19/02/2009

En detalle

Resumen

Information of a first type is determined at an integrated circuit die of a data processing device included an integrated circuit package. The integrated circuit package includes the first integrated circuit die and a second integrated circuit die. Information of a second type is determined at the integrated circuit die. The first and second type of information is transmitted from the integrated circuit die to another integrated circuit die using a time-divided multiplexed protocol by transmitting the first information during a first time slot of the protocol and transmitting the second information during a second time slot of the protocol.

Etiquetas

Inventores
Madrid Philip eEnnis Stephen C
Solicitantes
Advanced Micro Devices IncMadrid Philip eEnnis Stephen C
Clasificacion ipc
G01K 1/ 00 A IG01R 31/ 00 A IG06F 15/ 163 A IG06F 19/ 00 A I
Clasificacion cpc
702/118702/130702/57716/136
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