Resumen
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
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Índice de la ficha
- Updated at
- 24/07/2026
- Numero publicacion
- US.2002167075.A1
- Fecha publicacion
- 14/11/2002
- Numero solicitud
- US20010855820
- Fecha presentacion
- 14/05/2001
En detalle
Etiquetas
Inventores
Madrid Ruben
Solicitantes
Fairchild SemiconductorMadrid Ruben
Clasificacion ipc
B21D 22/ 02 A IH01L 21/ 48 A IH10W 70/ 60 A I
Clasificacion cpc
257/666257/676257/737257/739257/E23.069438/122438/666438/673