The device has a bearer plate (1) on which the microstructure is mounted and that is enclosed by a bearer frame (5) at a distance and a connecting arrangement connecting the plate and frame with at least one bridge body (13,14) with bearer frame, bearer plate and intermediate insulation holder connecting sections. The bridge body material has lower thermal conductivity than the bearer plate and bearer frame. Independent claims are also included for the following: a method of manufacturing a device for holding a microstructure to be heated.