An ultra-wideband hybrid structure for transmitting high-frequency electrical signals, the structure comprising a substrate, a high-speed semiconductor substrate connected to the substrate of the ultra-wideband structure, an electrical interconnection established between the substrate and the high-speed semiconductor substrate, an ultrahigh speed device defining a first access port and established on the high-speed semiconductor substrate, a dielectric waveguide structure defining a second access port, the structure established on the substrate and on the high-speed semiconductor substrate, the structure comprises a tapered end connectable to the first access port of the ultrahigh speed device, a metal waveguide structure providing a low-pass characteristic interconnection, the structure established on the substrate and on the high-speed semiconductor substrate, wherein the metal waveguide structure comprises a metal waveguide pattern defining a tapered coupler connected to the access port of the high-speed circuit or component.