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ULTRA-WIDEBAND INTERCONNECTION PROBESCM Patents

[0001] A ultra-wideband interconnection probe (100) connectable to a first access port of a first electronic device (101), the first access port comprising a first tapered coupler (101a) and to a second access port of a second electronic device (102), the second access port comprising a second tapered coupler (102a), the ultra-wideband interconnection probe (100) comprising a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises a first tapered end (120a) connectable to the first access port via the first tapered coupler (101a) and a second tapered end (120b) connectable to the second access port via the second tapered coupler (102a).

Datos clave

CategoríaInvención

Índice de la ficha

Updated at
05/11/2026
Numero publicacion
EP.3995836.A1
Fecha publicacion
11/05/2022
Anio publicacion
2022
Numero solicitud
EP20200382960

En detalle

Reivindicaciones

1. A ultra-wideband interconnection probe (100) connectable to a first access port (P1) of a first electronic device (101), the first access port comprising a first tapered coupler (101a) and to a second access port (P2) of a second electronic device (102), the second access port comprising a second tapered coupler (102a), the ultra-wideband interconnection probe (100) comprising: - a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises: - a first tapered end (120a) connectable to the first access port via the first tapered coupler (101a); and - a second tapered end (120b) connectable to the second access port via the second tapered coupler (102a). 2. The ultra-wideband interconnection probe (100) according to claim 1, wherein the dielectric waveguide structure (120) has a rectangular section. 3. The ultra-wideband interconnection probe (100) according to claims 1 or 2, further comprising a substrate (140) attached to the dielectric waveguide structure (120). 4. The ultra-wideband interconnection probe (100) according to claim 3, further comprising a metal waveguide structure (110) on the substrate (140), wherein the metal waveguide structure (110) comprises: - a bifilar transmission line (110c) with probe tips (110c') at both ends that connect to the tapered couplers (101a) and (102a) and establishes a low-pass filter characteristic interconnect, operating over a low frequency range from DC up to a high cut-off frequency fCH in the millimeter wave range. 5. A ultra-wideband interconnection probe (300) connectable to an access port (P1) of an electronic device (102), the access port comprising a tapered coupler (102a), the ultra-wideband interconnection probe (300) comprising: - a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises: - a first tapered end (120a); and - a second tapered end (120b) connectable to the access port of the electronic device via the tapered coupler (102a), - a substrate (140) attached to the dielectric waveguide structure (120); and - a metal waveguide structure (110) on the substrate (140), wherein the metal waveguide structure (110) comprises a metal waveguide pattern (110a) defining a tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-1a) around the first tapered end (120a) of the dielectric waveguide structure (120), defining an access port (P). 6. The ultra-wideband interconnection probe (300) according to claim 5, wherein the metal waveguide structure (110) further comprises a bifilar transmission line (110c) with probe tips (110c') that establishes a low-pass characteristic interconnect, operating over the low frequency range from DC up to fCH in the millimeter wave range. 7. An interconnect system comprising: - a rectangular waveguide; and - an ultra-wideband interconnection probe (300) according to claims 5 or 6. 8. A ultra-wideband interconnection probe (200) comprising: - a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises: - a first tapered end (120a); and - a second tapered end (120b); and - a metal waveguide structure (110) establishing a low-pass characteristic interconnect, operating over a low frequency range from DC up to a high cut-off frequency fCH in the millimeter wave range, wherein the metal waveguide structure (110) comprises: - a first metal waveguide pattern (110a) defining a first tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-1a) around the first tapered end (120a); and - a second metal waveguide pattern (110b) defining a second tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-1b) around the second tapered end (120b); and - a substrate (140) connected to the metal waveguide structure (110) and to the dielectric waveguide structure (120). 9. The ultra-wideband interconnection probe (200) according to claim 8, wherein the metal waveguide structure (110) further comprises: - a third metal waveguide pattern (110d) defining a third tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-2a) around the first tapered end (120a) for ultra-wide baseband operation, wherein (TSA-1a) and (TSA-2a) are electrically connected. 10. The ultra-wideband interconnection probe (200) according to claims 8 or 9, wherein the metal waveguide structure (110) further comprises a bifilar transmission line (110c) with at least two probe tips (110c') that establishes a low-pass characteristic interconnect, operating over the low frequency range from DC up to fCH in the millimeter wave range. 11. Use of the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10 as an antenna. 12. Use of the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10 as a nearfield coupler. 13. A signal transmitter device comprising: the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10; and a transmitter. 14. The signal transmitter device according to claim 13, wherein the transmitter comprises an opto-electronic converter (i.e. photodiode, photoconductive antenna and the like). 15. A signal receiver device comprising: the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10; and a receiver. 16. A signal receiver device according to claim 15, wherein the receiver comprises a Schottky Zero Bias Diode (ZBD) envelope detector. 17. An interconnect system comprising: a first electronic device (101) comprising a first access port having a first tapered coupler (101a); a second electronic device (102) comprising a second access port having a second tapered coupler (102a); and an ultra-wideband interconnection probe (100) according to claims 1 to 4.

Etiquetas

Inventores
Carpintero del Barrio GuillermoCARPINTERO del BARRIO, GuillermoRIVERA LAVADO, AlejandroRivera Lavado AlejandroGarcía Muñoz LuisGARCÍA MUÑOZ, LuisAli MuhsinALI, MuhsinGarcía Muñoz Luis EnriqueGARCÍA MUÑOZ, Luis Enrique
Solicitantes
Universidad Carlos III de Madrid
Clasificacion ipc
G01R 1/ 067 A IG01R 1/ 07 A IH01P 3/ 16 A I
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