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Film manufacture method for making films of semiconductor materials including intermediate band, involves loosening polycrystalline material to form powder, and compacting it through pressure application to form target of pressed particlesCM Patents

Índice de la ficha

Updated at
24/07/2026
Numero publicacion
EP.2256791.A1
Fecha publicacion
01/12/2010
Numero solicitud
EP20090715579

En detalle

Resumen

This invention describe a process for obtaining thin films of intermediate band semiconductor materials consisting of obtaining a target of compressed particles of the said material for its use in sputtering equipment. The target is obtained by means of the thermal process of a mixture of semiconductor material components, following a specific profile of temperatures and times, in order to obtain a material in a polycrystalline form of the same composition as the intermediate band semiconductor material. The polycrystalline material is disintegrated again by means of mechanical processes in the form of a powder and is then compacted, through the application of a suitable pressure in order to form a target.

Reivindicaciones

1. Procedure for obtaining films of intermediate band semiconductor materials characterized in that it comprises the following steps: - preparation of the mixture of the components of the semiconductor material in the form of a powder, - thermal processing of the mixture of the components of the semiconductor material obtained in the previous stephigher than the melting point of its components up to its synthesis in the form of a thermodynamically stable polycrystalline semiconductor material, - disintegration of the polycrystalline material obtained in the previous step by means of mechanical grinding until a homogeneous powder is obtained, - compressing of the homogenous powder until it has a consistency and shape suitable for its placing onto an electrode of a sputtering machine, - Obtaining the thin films of intermediate band semiconductor material by means of the sputtering of the compressed powder. 2. Procedure in accordance with demandaccording to claim 1 characterized becausein that, in a preferred method, the semiconductor material consists of a stoichiometric mixture of its components. 3. Procedure in accordance with demandsaccording to claim 1 or claim 2 characterized becausein that, in a preferred method, before the thermal processing, the mixture of the semiconductor material is introduced into a recipient container in which there is a controlled atmosphere in order to avoid the contamination of the mixture at high temperatures.

Etiquetas

Inventores
Castaner Munoz LuisLuque Lopez AntonioMarti Vega Antonio
Solicitantes
Universidad Politécnica de MadridUniversitat Politècnica de CatalunyaUniv Catalunya PolitecnicaCastaner Munoz LuisLuque Lopez AntonioMarti Vega Antonio
Clasificacion ipc
C23C 14/ 35 A IH10P 14/ 22 A IC23C 14/ 34 A I
Clasificacion cpc
204/192.1
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