Logo
About usInnovation CMChallengesEuropa2iEntrepreneurshipR&D&I SearchAgentsEventsReports
en
Memory structure comprising scratchpad memoryCM Patents

Índice de la ficha

Updated at
24/07/2026
Numero publicacion
US.2018101483.A1
Fecha publicacion
12/04/2018
Numero solicitud
US201715726749
Fecha presentacion
06/10/2017

En detalle

Resumen

[0001] The present disclosure relates to a memory hierarchy for a system-in-package. An example memory hierarchy is connectable to a processor via a memory management unit arranged for translating a virtual address sent by the processor into a physical address. The memory hierarchy has a data cache memory and a memory structure having at least a L1 memory array comprising at least one cluster. The memory structure comprises a first data access controller arranged for managing one or more banks of scratchpad memory of at least one of the clusters of at least the L1 memory array, comprising a data port for receiving at least one physical address and arranged for checking at run-time, for each received physical address, bits of the physical address to see if the physical address is present in the one or more banks of the at least one cluster of at least the L1 memory array.

Etiquetas

Inventores
Catthoor FranckyHartmann MatthiasGomez Jose IgnacioTenllado ChristianXydis SotirisSetoain Rodrigo JavierPapastergiou ThomasBaloukas ChristosDas Anup KumarSoudris Dimitrios
Solicitantes
Imec VzwStichting Imec NederlandUniversidad Complutense de MadridStitching Imec Nederland
Clasificacion ipc
G06F 12/ 00 A IG06F 12/ 0811 A IG06F 12/ 0897 A IG06F 12/ 1009 A IG06F 12/ 1045 A IG06F 12/ 122 A IG06F 12/ 128 A I
Publicaciones
US.2018101483.A1
Logo

Innovation CM
Challenges
Europa2i
Entrepreneurship
R&D&I Search
Agents
Events
Reports
About us
Contact
Give us your opinion
Cookies
Legal notice
Privacy

© Copyright Espacio Madrileño de Investigación e Innovación 2026