Resumen
[0001] A ultra-wideband interconnection probe (100) connectable to a first access port of a first electronic device (101), the first access port comprising a first tapered coupler (101a) and to a second access port of a second electronic device (102), the second access port comprising a second tapered coupler (102a), the ultra-wideband interconnection probe (100) comprising a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises a first tapered end (120a) connectable to the first access port via the first tapered coupler (101a) and a second tapered end (120b) connectable to the second access port via the second tapered coupler (102a).
Reivindicaciones
1. A ultra-wideband interconnection probe (100) connectable to a first access port (P1) of a first electronic device (101), the first access port comprising a first tapered coupler (101a) and to a second access port (P2) of a second electronic device (102), the second access port comprising a second tapered coupler (102a), the ultra-wideband interconnection probe (100) comprising: - a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises: - a first tapered end (120a) connectable to the first access port via the first tapered coupler (101a); and - a second tapered end (120b) connectable to the second access port via the second tapered coupler (102a). 2. The ultra-wideband interconnection probe (100) according to claim 1, wherein the dielectric waveguide structure (120) has a rectangular section. 3. The ultra-wideband interconnection probe (100) according to claims 1 or 2, further comprising a substrate (140) attached to the dielectric waveguide structure (120). 4. The ultra-wideband interconnection probe (100) according to claim 3, further comprising a metal waveguide structure (110) on the substrate (140), wherein the metal waveguide structure (110) comprises: - a bifilar transmission line (110c) with probe tips (110c') at both ends that connect to the tapered couplers (101a) and (102a) and establishes a low-pass filter characteristic interconnect, operating over a low frequency range from DC up to a high cut-off frequency fCH in the millimeter wave range. 5. A ultra-wideband interconnection probe (300) connectable to an access port (P1) of an electronic device (102), the access port comprising a tapered coupler (102a), the ultra-wideband interconnection probe (300) comprising: - a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises: - a first tapered end (120a); and - a second tapered end (120b) connectable to the access port of the electronic device via the tapered coupler (102a), - a substrate (140) attached to the dielectric waveguide structure (120); and - a metal waveguide structure (110) on the substrate (140), wherein the metal waveguide structure (110) comprises a metal waveguide pattern (110a) defining a tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-1a) around the first tapered end (120a) of the dielectric waveguide structure (120), defining an access port (P). 6. The ultra-wideband interconnection probe (300) according to claim 5, wherein the metal waveguide structure (110) further comprises a bifilar transmission line (110c) with probe tips (110c') that establishes a low-pass characteristic interconnect, operating over the low frequency range from DC up to fCH in the millimeter wave range. 7. An interconnect system comprising: - a rectangular waveguide; and - an ultra-wideband interconnection probe (300) according to claims 5 or 6. 8. A ultra-wideband interconnection probe (200) comprising: - a dielectric waveguide structure (120) establishing a high-pass characteristic interconnect, operating over a high frequency range starting from a low cut-off frequency fCL in the microwave range or in the millimeter-wave range, wherein the dielectric waveguide structure (120) comprises: - a first tapered end (120a); and - a second tapered end (120b); and - a metal waveguide structure (110) establishing a low-pass characteristic interconnect, operating over a low frequency range from DC up to a high cut-off frequency fCH in the millimeter wave range, wherein the metal waveguide structure (110) comprises: - a first metal waveguide pattern (110a) defining a first tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-1a) around the first tapered end (120a); and - a second metal waveguide pattern (110b) defining a second tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-1b) around the second tapered end (120b); and - a substrate (140) connected to the metal waveguide structure (110) and to the dielectric waveguide structure (120). 9. The ultra-wideband interconnection probe (200) according to claim 8, wherein the metal waveguide structure (110) further comprises: - a third metal waveguide pattern (110d) defining a third tapered coupler, preferably a Tapered Slot Antenna "TSA" (TSA-2a) around the first tapered end (120a) for ultra-wide baseband operation, wherein (TSA-1a) and (TSA-2a) are electrically connected. 10. The ultra-wideband interconnection probe (200) according to claims 8 or 9, wherein the metal waveguide structure (110) further comprises a bifilar transmission line (110c) with at least two probe tips (110c') that establishes a low-pass characteristic interconnect, operating over the low frequency range from DC up to fCH in the millimeter wave range. 11. Use of the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10 as an antenna. 12. Use of the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10 as a nearfield coupler. 13. A signal transmitter device comprising: the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10; and a transmitter. 14. The signal transmitter device according to claim 13, wherein the transmitter comprises an opto-electronic converter (i.e. photodiode, photoconductive antenna and the like). 15. A signal receiver device comprising: the ultra-wideband interconnection probes (100, 200, 300) according to claims 1 to 10; and a receiver. 16. A signal receiver device according to claim 15, wherein the receiver comprises a Schottky Zero Bias Diode (ZBD) envelope detector. 17. An interconnect system comprising: a first electronic device (101) comprising a first access port having a first tapered coupler (101a); a second electronic device (102) comprising a second access port having a second tapered coupler (102a); and an ultra-wideband interconnection probe (100) according to claims 1 to 4.
